Figure AI’s 24-Hour Robot Test Just Created A New Market For Nvidia. The Real Winner Of Figure AI’s Robot Breakthrough Could Be Nvidia ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above stacks ...

In a recent disclosure from its latest 13F filing, Advanced Micro Devices (AMD 0.97%) revealed a new equity stake in Marvell ...

The semiconductor industry is one of the most advanced and complex in the world. The semiconductor industry relies on highly ...

HRL will present initial data from the project at the GOMACtech conference next week in Pasadena, Calif. HRL is directing the overall program, leading the system design, developing thermal isolation ...

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...

Applied Materials has revealed chip wiring innovations that will help address challenges in the way of energy-efficient computing. The use of new materials in chip wiring will enable two-nanometer ...

Yesterday it was the "roof tile" method of stacking memory chips, and today IBM and 3M have announced that they are teaming up to develop a silicon glue that can be used to form "towers" out of ...