May 20 (Reuters) - Lam Research has opened a research lab in Salzburg, Austria, to advance a chip packaging technology that promises to increase chip density and cut costs, as the company looks to ...

Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and ...

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

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Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration ...

Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as ...

FREUDENSTADT, Germany - SCHMID Group (NASDAQ:SHMD) delivered its first null Line H+ system for Panel-Level Packaging applications to a U.S. technology company, according to a press release statement.

That packaging technology replaces the semiconductor industry's traditional circular silicon wafers with square panels. Round wafers waste material at the curved edges where full chips cannot be cut.