SEOUL, June 9 (Reuters) - Samsung Electronics is considering the construction of an advanced semiconductor packaging facility in the southwestern South Korean city of Gwangju, the Korea Economic Daily ...

Nvidia's AI chips will be the first to rely on the new tech. According to sources familiar with the matter, TSMC is working ...

TSMC’s capacity struggles are turning into a boon for Intel. As the Taiwanese chip making giant struggles to meet ...

Xanadu Quantum Technologies Limited ("Xanadu") (Nasdaq: XNDU) (TSX: XNDU) today announced a new accomplishment in ultra-low loss photonic chip packaging, achieving ultra-low edge-coupling loss for its ...

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

TSMC is working on a new advanced chip packaging technology called CoPoS as AI chips become larger and more complex, according to industry reports. CoPoS ...

Samsung Electronics is evaluating plans to build an advanced semiconductor packaging facility in Gwangju, a city in southwestern South Korea, the Korea Economic Daily reported Tuesday.

Samsung Electronics is exploring a significant investment in Gwangju, South Korea. The company is considering a new advanced ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...