Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...

Taiwan's PCB equipment suppliers are optimistic that IC substrate process facilities requiring ever-higher equipment cleanliness and procession will become their major growth driver in the next decade ...

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry ...

That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s ...

Printed circuit board (PCB) was introduced as a replacement for bulky wiring circuits almost a century ago. Today, it’s the core of the electronics industry, supporting the latest designs like IoT, AI ...