Design And Reuse

Running multiple AI agents on one repo? You’ve probably hit the merge wall.

For semiconductor design teams coordinating RTL, firmware, and verification with multiple AI-assisted contributors, that ...
Design And Reuse

Tesla-Samsung AI5 Chip Hits Tape-Out at Taylor Fab on 2nm Process

A Samsung Foundry engineer has publicly corroborated that the Tesla-Samsung AI5 chip has reached tape-out, marking the completion of its design phase and clearing the runway for manufacturing at ...
Design And Reuse

Embedded SoC Design Mistakes Startups Must Avoid

The race to build innovative semiconductor products is accelerating as startups enter markets such as Artificial Intelligence ...
Design And Reuse

Dolphin Semiconductor and INTERA Group Announce Reference Platform Combining Analog Voice Sensing and Neuromorphic AI for Ultra-Low-Power Edge Intelligence

Dolphin Semiconductor, a leading provider of semiconductor IP solutions, and INTERA Group, a semiconductor innovation company specializing in neuromorphic ASIC architectures, today announced a ...
Design And Reuse

High-Speed SerDes Design: Architecture, Equalization, and CDR Circuits

High-Speed Serializer/Deserializer (SerDes) technology addresses these challenges by enabling efficient communication over ...
Design And Reuse

Asset Lifecycle Management at the Edge

By processing data at the edge, manufacturers can analyze asset behavior, detect issues faster, and act on insights much ...
Design And Reuse

»Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices

With the RISC-V Secure Element, the Fraunhofer Institutes for Integrated Circuits IIS, for Applied and Integrated Security AISEC, and for Electronic Microsystems and Solid State Technologies EMFT are ...
Design And Reuse

Multi-Protocol Communication Systems Deliver a Richer User Experience

Consumer and industrial product builders see blossoming opportunity and are demanding multi-protocol options in support of ...
Design And Reuse

Axelera AI Publicly Releases Voyager Wingman, an AI Assistant That Speeds Application Development

Natural-language companion to the Voyager® Toolkit helps developers rapidly build high-accuracy ML pipelines, debug faster, quickly find answers, and optimize performance for Axelera-based systems ...
Design And Reuse

High-Speed Heterogeneous Integration with Multiphysics Analysis for TSMC SoW-X

TSMC's System-on-Wafer (TSMC-SoW™) technology and its highly advanced design necessitate a reliable and efficient ...
Design And Reuse

China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

China's DFSX is working on fueling its domestic AI supply chain with next-gen 3.5D "Infinity Chiplet" architectures & 3D DRAM technologies. DFSX Is Working on China's First DF1000 AI Accelerator With ...
Design And Reuse

Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?

The U.S.-based Intel, which had been subjected to harsh criticism for issuing ‘empty promises’ while struggling immensely to secure yield in micro-fabrication processes, has reportedly finally ...