Nvidia acquires Hugging Face for $12.9 billion, expanding reach across open-source AI models, datasets, and software ...

Discover how holistic digital twins help automakers shift left, overcome integration complexity and accelerate modern ...

As agentic AI shifts to the edge, sustained performance hinges on thermal management, making microcooling critical to avoid throttling.

The CXL-attached memory expansion uses NAND flash optimized for high-speed processing alongside AI compute devices.

Qualcomm’s Modular buyout targets cross-chip portability across Nvidia, AMD, and its own AI hardware to break the software ...

SUSE targets sovereign AI via architectural choice, enabling enterprises to pivot between Nvidia and AMD silicon without ...

The EE Times Magazine explores how ambient energy harvesting, sensing, AI, and connectivity enable safer, smarter buildings.

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...

TLS360™ is Rochester Electronics’ lifecycle assurance program, extending select mission-critical semiconductors beyond EOL ...

Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling ...

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...