Quick recap: 2.5D packaging uses an interposer with extremely high routing density, enabling faster signal transmission and lower power consumption between dies. Examples include TSMC’s CoWoS and ...

TrendForce 2026 San Francisco Roadshow arrives October 16. Join us to unpack the latest on memory, AI server deployment, and the widening US-China divide in AI infrastructure: REGISTER HERE. Over the ...

Correction: An earlier version of this article incorrectly listed the English name of glass fiber cloth supplier 宏和電子材料 as "Hongho Precision Textile." The ...

“The memory system of AIs is going to cause the storage system to be completely revolutionized.” At GTC Taipei in June 2026, Nvidia founder and CEO Jensen Huang pointed to the memory system as one of ...

In March 2026, two announcements arrived in quick succession: Nvidia began selling its Vera CPU as a standalone product, and Arm unveiled its first in-house CPU, the Arm AGI CPU. That a GPU company ...

The AI infrastructure buildout is often discussed in terms of chips and computing power. But beneath the surface, a set of supply chain bottlenecks is quietly shaping the pace and cost of deployment.

In 2026, the global build-out of AI data centers (AIDCs) has entered a critical phase of large-scale deployment. The explosive growth in computing demand is reshaping global power consumption patterns ...

With Apple reportedly set to unveil its first foldable iPhone in fall 2026, the market’s attention has turned back to foldable technology. This is not a specs leak or a rumor roundup, but a broader ...

Recent reports suggest China may ease restrictions on NVIDIA H200 imports, potentially opening new opportunities for the GPU. However, TrendForce’s latest supply chain checks show that successful H200 ...

As test-time scaling takes hold, the focus of the AI industry is quickly shifting from training to inference. NVIDIA, Google, and other major AI players rolled out inference-specific chips in the ...

The AI infrastructure buildout is often discussed in terms of chips and computing power. But beneath the surface, a set of supply chain bottlenecks is quietly shaping the pace and cost of deployment.