New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

At GTC 2025, Nvidia CEO Jensen Huang projected $1 trillion in global data center CapEx by 2028. At this pace, data center ...

Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

Increasing complexity of semiconductor devices necessitates a fundamental rethinking of defect detection methodologies.

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...