TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare ...

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly.

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and advanced debug.

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...

We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrication techniques that provide precise ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...