In July 2015, Sen, Nima Kalantari, then an ECE PhD student, and fellow PhD student Steve Bako published a paper with their solution: applying machine learning, a nascent approach at the time, to speed ...
Three-dimensional integrated circuits stack multiple dies to reach integration densities beyond the limits of planar scaling, but the same vertical integration concentrates power in a small volume and ...
This proposed schedule is subject to change. To review the most up-to-date listings of all courses, instructors, times and locations refer to GOLD (UCSB Student Gaucho On-line Data). If you do not ...
Tremendous progress is being made at silicon photonic foundries around the world to improve the performance, yield and capability of photonic integrated circuits (PICs) and that is opening up new ...
As computing continues to be used for increasingly private and sensitive operations impacting all aspects of our lives, the need to maintain tight control of those computations only continues to grow.
Data-driven approaches, especially those that leverage deep learning (DL), have led to significant progress for many important problems in computer vision and image/video processing over the last ...
Shigeki Yoshida is presenting record Ka-band power density from N-polar GaN HEMTs of 12.8 W/mm at 28 GHz, utilizing N-polar GaN/InAlN HEMTs. Shigeki Yoshida received the B.E. and M.E. degrees in ...
The Quantum Nanophotonics Group at the National Institute of Standards and Technology (NIST) in Boulder, CO develops new semiconducting and superconducting technologies for advanced metrology needs ...
In this talk, I will discuss the latest developments in the GlobalFoundries Fotonix TM program, including enhancements in device performance, packaging, PDK compact models, and in-house test ...
Due to inherent complex behaviors and stringent requirements in analog and mixed-signal (AMS) systems, verification and testing become key bottlenecks in the product development cycle. Rare failure ...
This seminar features short research talks covering a range of topics across AI, photonics, communications, control, and computing systems. Learn about ongoing work in the department and connect with ...
The integration of active and passive optical components on-chip is critical for reducing size, weight and power, and realizing useful photonic integrated circuits (PICs). III-V substrates allow for ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results