Artificial intelligence is creating a growing memory bottleneck, with Bernstein analysts saying demand is spreading beyond high-bandwidth memory into conventional DRAM, NAND flash and storage.

HUMAIN and MinIO are establishing a strategic engineering and go-to-market partnership. As part of today's agreement, MinIO is now HUMAIN's data and memory foundation partner, beginning with HUMAIN ...

The next phase of AI will be determined by whether the infrastructure can deliver intelligence reliably, economically and at ...

Thinner dies, more TSV area, thermal dissipation, and limited manufacturing capacity make HBM scaling much more difficult.

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. The 2026 IEEE Hot Chips Conference, marked by record attendance, underscored the critical ...

NVIDIA says NVHBM can deliver up to 30% more memory bandwidth than HBM4E while cutting HBM power consumption by roughly 15 ...

NVIDIA and MediaTek on August 31, 2026, announced an expansion of their long-standing collaboration to build the next ...

The AI Stack Model splits the AI trade into 14 segments across 4 layers, scoring each on macro conditions, estimate revisions, and how much the market has already paid. Memory wins on fundamentals - ...

Samsung Electronics showcased its next-generation 3D memory architectures at the Future of Memory and Storage 2026 in California on Tuesday ...

As datasets for AI and data-intensive workloads scale beyond traditional hardware boundaries, data centers are severely bottlenecked by static local memory limits. Primemas and Micron Technology are ...

Some of NVIDIA Corporation (NASDAQ:NVDA)’s largest customers have been told that prices of servers ‌containing its AI chips ...

At the Hot Chips 2026 conference's Advance Program, Samsung's Sangwook Han confirmed that the company is preparing to ship ...