Semiconductor Engineering

Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.)

Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a ...
Semiconductor Engineering

Molybdenum Quasi Phase-Only Masks Improve EUV Imaging (NYCU, TSMC)

Researchers at National Yang Ming Chiao Tung University and TSMC published a technical paper titled “High contrast EUV ...
Semiconductor Engineering

Reducing HBM ECC Controller Overhead For AI Inference (RPI, IBM)

Researchers at Rensselaer Polytechnic Institute and IBM T.J. Watson Research Center published a technical paper titled “REACH: Controller-Managed Long-Span ECC for HBM AI Inference.” Abstract Excerpt: ...