Design And Reuse

Embedded SoC Design Mistakes Startups Must Avoid

The race to build innovative semiconductor products is accelerating as startups enter markets such as Artificial Intelligence ...
Design And Reuse

Running multiple AI agents on one repo? You’ve probably hit the merge wall.

For semiconductor design teams coordinating RTL, firmware, and verification with multiple AI-assisted contributors, that ...
Design And Reuse

Dolphin Semiconductor and INTERA Group Announce Reference Platform Combining Analog Voice Sensing and Neuromorphic AI for Ultra-Low-Power Edge Intelligence

Dolphin Semiconductor, a leading provider of semiconductor IP solutions, and INTERA Group, a semiconductor innovation company specializing in neuromorphic ASIC architectures, today announced a ...
Design And Reuse

Axelera AI Publicly Releases Voyager Wingman, an AI Assistant That Speeds Application Development

Natural-language companion to the Voyager® Toolkit helps developers rapidly build high-accuracy ML pipelines, debug faster, quickly find answers, and optimize performance for Axelera-based systems ...
Design And Reuse

Tesla-Samsung AI5 Chip Hits Tape-Out at Taylor Fab on 2nm Process

A Samsung Foundry engineer has publicly corroborated that the Tesla-Samsung AI5 chip has reached tape-out, marking the completion of its design phase and clearing the runway for manufacturing at ...
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High-Speed Heterogeneous Integration with Multiphysics Analysis for TSMC SoW-X

TSMC's System-on-Wafer (TSMC-SoW™) technology and its highly advanced design necessitate a reliable and efficient ...
Design And Reuse

Cabinet approves Rs 1.27 lakh crore Semicon 2.0 to strengthen India’s semiconductor ecosystem

The Union Cabinet, chaired by Prime Minister Narendra Modi, on Wednesday approved Semicon 2.0, a comprehensive programme with a budget outlay of ₹1,27,500 crore aimed at strengthening India’s ...
Design And Reuse

TYLsemi Raises $43 Million to Launch First Full-Stack Chiplet Platform for Custom AI Silicon

First production-ready chiplet portfolio spanning connectivity, power, and memory for XPUs; Reduces custom AI silicon development time and cost by up to 50% from architecture to h ...
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TrendForce Forecasts Up to 18% Server DRAM Price Increase in 3Q

Server DRAM contract prices are expected to climb as supply constraints and future shortages drive customer procurement. Server DRAM contract prices are expected to increase by 13% to 18% quarter over ...
Design And Reuse

Spain Semiconductor Industry Convenes to Forge Domestic Alliances

Spain’s semiconductor industry is working to strengthen collaboration across companies, universities, and research centers as it seeks to build a more connected national ecosystem. That effort was ...
Design And Reuse

Defacto’s SoC Compiler Drastically Improved Productivity of L&T Semiconductor Technologies

Defacto Technologies today announced the successful collaboration with L&T Semiconductor Technologies (LTCST), helping reducing drastically design time and engineering resources to build new ...
Design And Reuse

Intel Invests €5 Billion to Expand Manufacturing in Europe

Investment is expected to create permanent high-tech jobs and engage specialised tradespeople, while expanding leading-edge manufacturing capacity in Ireland. LEIXLIP, Ireland —Intel today announced a ...