TV TV panel demand continues to strengthen in September. Ahead of the year-end peak season, major brands are expected to ...

While TSMC has yet to deploy High-NA EUV for advanced-node commercialization, the foundry giant today laid out a clear ...

China’s leading DRAM maker CXMT has officially announced mass production of LPDDR6, with the next-generation memory making ...

Huawei has introduced a new flagship Kirin chip alongside its latest tri-fold smartphone. According to Mydrivers, Huawei ...

On September 4, Starksemi Semiconductor (Wuhan) Co., Ltd. announced the completion of a new funding round exceeding CNY 1 ...

Samsung is stepping up its silicon photonics development by bringing key testing capabilities in-house. According to The Elec, sources say Samsung is ...

As demand grows for high-value memory used in servers and AI, SK hynix is accelerating its shift to more advanced DRAM.

TSMC’s 3nm node is set for a stronger ramp in 2H26, fueled by surging demand for AI and high-performance computing (HPC), ...

Huawei is offering new data to support its chip-scaling approach, suggesting that higher transistor density does not ...

As AI workloads demand ever more memory, DRAM's physical capacity ceiling is becoming the bottleneck. At a September 3rd ...

Ahead of Apple’s product launch event later this week, memory is back in the spotlight as surging prices put the company’s sourcing strategy under ...

During its Investor Open Day on August 28, TCL Technology detailed its strategic layout in optical communications for the ...