NVIDIA NVHBM moves the HBM memory controller off the AI accelerator die and buries it inside the memory stack itself, freeing ...
Artificial intelligence is creating a growing memory bottleneck, with Bernstein analysts saying demand is spreading beyond high-bandwidth memory into conventional DRAM, NAND flash and storage.
Samsung HBM5 targets twice the overall performance of HBM4E, with 20 percent better efficiency and 20 percent lower thermal ...
Samsung presented its updated memory roadmap at SEMICON Taiwan 2026, with HBM5 and the upcoming zHBM architecture being the ...
Matrix is tackling the 3D DRAM heat problem by stacking memory beneath the XPU, but atomic-level flatness remains a brutal ...
The next phase of AI will be determined by whether the infrastructure can deliver intelligence reliably, economically and at ...
Thinner dies, more TSV area, thermal dissipation, and limited manufacturing capacity make HBM scaling much more difficult.
The total HBM market is projected to grow from $35 billion in 2025 to $54.6 billion in 2026, an increase of more than 50% in ...
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CXMT reportedly begins risk production of HBM3E memory in breakthrough for Chinese DRAM production
CXMT is reportedly sampling its HBM3E memory with Alibaba Group's T-Head and Cambricon Technologies.
NVIDIA says NVHBM can deliver up to 30% more memory bandwidth than HBM4E while cutting HBM power consumption by roughly 15 ...
Samsung Electronics on Tuesday showcased its 3D architecture strategy to break through current limitations in memory chip ...
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