Artificial intelligence is creating a growing memory bottleneck, with Bernstein analysts saying demand is spreading beyond high-bandwidth memory into conventional DRAM, NAND flash and storage.

Samsung Electronics and SK Hynix used this year’s Future of Memory and Storage conference in Santa Clara to lay out competing answers to a problem that has quietly become the biggest constraint on ...

Samsung Electronics showcased its next-generation 3D memory architectures at the Future of Memory and Storage 2026 in California on Tuesday ...

In the AI infrastructure boom, Nvidia (NVDA-4.58%) sells the brains of the AI factory while Micron (MU-0.27%) supplies the ...

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High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

TL;DR: SK hynix has introduced the world's first 16-Hi HBM3E memory, offering up to 48GB per stack, marking the highest capacity and layer count in HBM memory. This development follows NVIDIA's ...

The AI Stack Model splits the AI trade into 14 segments across 4 layers, scoring each on macro conditions, estimate revisions, and how much the market has already paid. Memory wins on fundamentals - ...

Use left and right arrow keys to seek audio. Rambus has provided more details on its upcoming HBM4 memory controller, which offers some huge upgrades over current HBM3 and HBM3 memory controllers.