BEIJING, Feb. 10 (Xinhua) -- Chinese scientists have developed a high-performance computing-in-memory device using a novel engineered material. This breakthrough provides a crucial foundation for ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

Cerebras Systems Inc.'s IPO outlook: wafer-scale AI chips, OpenAI deal & AI data center growth. Click for this close look at ...

TSMC chairman C.C. Wei confirmed adjustments in 8-inch and mature process capacities to improve efficiency, with Samsung also cutting 8-inch output. Despite these reductions and price hikes by Chinese ...

Nexperia's Chinese unit secures local wafer supplies for 2026, ensuring continued production despite a dispute with its Dutch parent over control. While Beijing and the Dutch relaxed certain measures, ...

Delicate, puffy cream wafers that sandwich buttercream filling are known as “Danish waffles” in the Scandinavian bakeries of Solvang, Calif. These are from a recipe handed down to Janice Knight, who ...

Corning’s Michigan ingot and wafer plant puts it in a strong position to corner the market for US-made, FEOC compliant products. Image: Corning. At the end of October, Corning announced that it had ...

The global integrated circuit (IC) industry is confronting the physical limitations of Moore's Law. Atomic-layer-thick two-dimensional (2D) semiconductors, such as Molybdenum Disulfide (MoS2), are ...

Forward-looking: The engine of the digital age is running up against the laws of physics. Modern semiconductors, the microscopic foundations of computing, are nearing their physical limits just as ...