Cassie Sheng is an R&D process integration engineer at imec, Belgium, where she has been working since 2023. She received her ...

We trust designers to do the best they can, but know they cannot be perfect. That's why we verify. When AI gets involved, it ...

Pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold ...

Researchers from the Massachusetts Institute of Technology (MIT), Georgia Tech, and Penn State University embedded gallium ...

Researchers at the University of Oxford published a technical paper titled “Hardware-Managed Heterogeneous High-Bandwidth ...

As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But ...

Researchers from University of Alberta published a technical paper titled “PPAPlace: Differentiable Cross-Stage Objectives ...

Researchers from Purdue University published a technical paper titled “Architecting the Next Generation of Asynchronous, ...

Thermal drift, stress, electromagnetic coupling, and verification gaps are turning optical integration into a full-system co-design problem rather than a plug-in bandwidth upgrade.

Researchers from TU Wien and Silvaco Europe published a technical paper titled “The influence of implantation conditions on ...

AI is supposed to be the answer to this. But for many teams, the AI conversation stalls before it starts, because it gets ...

Researchers from Georgia Institute of Technology published a technical paper titled “Thermal Tuning Overhead in Wafer-Scale ...